Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 10
They are listed in Table IV . The dielectric constant values , obtained by optical
and electrical measurements , are given in Table V . It should be noted that some
polyimide films have considerable anisotropy in its dielectric properties .
They are listed in Table IV . The dielectric constant values , obtained by optical
and electrical measurements , are given in Table V . It should be noted that some
polyimide films have considerable anisotropy in its dielectric properties .
Page 142
At higher temperature, the Young's modulus reduces significantly and the
elongation at break (EAB) is substantially higher (see Table 1). Young's modulus
of various electronic materials are listed in Table 3 for comparison purpose.
Figure 4 ...
At higher temperature, the Young's modulus reduces significantly and the
elongation at break (EAB) is substantially higher (see Table 1). Young's modulus
of various electronic materials are listed in Table 3 for comparison purpose.
Figure 4 ...
Page 209
Metal deposited on parylene has weak adhesion . This can be improved by using
PIB metal deposition technique . A glue layer of Cr or Ti also improves adhesion
drastically , in particular wet ambient . Table V lists some adhesion results with ...
Metal deposited on parylene has weak adhesion . This can be improved by using
PIB metal deposition technique . A glue layer of Cr or Ti also improves adhesion
drastically , in particular wet ambient . Table V lists some adhesion results with ...
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Contents
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Thermal and Mechanical Properties of Low K Polymers | 123 |
Dielectric Properties of Low Dielectric Constant | 135 |
Copyright | |
16 other sections not shown
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Common terms and phrases
absorption addition adhesion alternating annealing applications block bond bulk capacitance chemical circuit coating compared copolyimide copolymer copper cured decrease density deposition determined device effect electrical electronic etch Figure film thickness fluorinated foamed followed frequency function glass higher improve increase indicate integrated interconnect interlayer dielectric layer loss low dielectric constant lower materials measured mechanical metal method microelectronics modulus moisture monomers observed obtained organic oxide Parylene patterns peak performance permittivity planarization plasma polishing polyimide polyimide film polymer polymerization prepared presented properties range reactor reduce refractive reported requirements Research resistance sample shows silica aerogels silicon SiO2 SOG film solution solvent step stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal stability thickness thin films treatment values vapor Volume wafers weight
Bibliographic information
| Title | Low-dielectric Constant Materials Materials Research Society symposia proceedings |
| Publisher | Materials Research Society, 1995 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 1558992847, 9781558992849 |
| Export Citation | BiBTeX EndNote RefMan |