Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 10
... adhesion of various low k dielectric films on different substrate surfaces were studied by using a simple adhesive tape test . The results are summarized in Table VII . As indicated in Table VII , the adhesion was poor for many of the ...
... adhesion of various low k dielectric films on different substrate surfaces were studied by using a simple adhesive tape test . The results are summarized in Table VII . As indicated in Table VII , the adhesion was poor for many of the ...
Page 64
... Adhesion Quantifying the adhesion of thin film to a substrate is a difficult problem for which no highly reliable and unambiguous methods have been established . We have observed qualitatively that adhesion of FLARE TM coatings to SiO2 ...
... Adhesion Quantifying the adhesion of thin film to a substrate is a difficult problem for which no highly reliable and unambiguous methods have been established . We have observed qualitatively that adhesion of FLARE TM coatings to SiO2 ...
Page 219
... Adhesion must be accomplished with the use of an adhesion promoter . In our case , we used y - aminopropyltriethoxysilane ( APS ) , which also is commercially available . The planarization requirements are not overly demanding when only ...
... Adhesion must be accomplished with the use of an adhesion promoter . In our case , we used y - aminopropyltriethoxysilane ( APS ) , which also is commercially available . The planarization requirements are not overly demanding when only ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch