Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 125
... Aerogel samples with two densities , are measured and compared . Figures 6 and 7 are the plots of load vs ... Aerogel samples are three distinct families . Besides having lower dielectric constants , organic polymers and Aerogel samples ...
... Aerogel samples with two densities , are measured and compared . Figures 6 and 7 are the plots of load vs ... Aerogel samples are three distinct families . Besides having lower dielectric constants , organic polymers and Aerogel samples ...
Page 268
... aerogel may thus be classified as a solid even though the distributed solid mass occupies only a fraction of its total volume . Figure 1 shows a simplified structural model for silica aerogel in which two levels of porosity are ...
... aerogel may thus be classified as a solid even though the distributed solid mass occupies only a fraction of its total volume . Figure 1 shows a simplified structural model for silica aerogel in which two levels of porosity are ...
Page 269
... aerogel and affects the dielectric properties , because it does not appear to significantly modify the linearity with density . SILICA AEROGEL SYNTHESIS AND PROCESSING Bulk Silica Aerogels The sol - gel chemistry used to prepare silica ...
... aerogel and affects the dielectric properties , because it does not appear to significantly modify the linearity with density . SILICA AEROGEL SYNTHESIS AND PROCESSING Bulk Silica Aerogels The sol - gel chemistry used to prepare silica ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch