Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
From inside the book
Results 1-3 of 9
Page 267
SILICA AEROGEL : AN INTRINSICALLY LOW DIELECTRIC CONSTANT
MATERIAL * LAWRENCE W . HRUBESH Chemistry and ... ABSTRACT Silica
aerogels are highly porous solids having unique morphologies in which both the
pores and ...
SILICA AEROGEL : AN INTRINSICALLY LOW DIELECTRIC CONSTANT
MATERIAL * LAWRENCE W . HRUBESH Chemistry and ... ABSTRACT Silica
aerogels are highly porous solids having unique morphologies in which both the
pores and ...
Page 270
Metallization and Patterning The surfaces of as - prepared silica aerogel are
sufficiently smooth to allow direct metallization by ... Qualitative tests show that
the aerogels can be sealed from subsequent semiconductor process liquids so
that ...
Metallization and Patterning The surfaces of as - prepared silica aerogel are
sufficiently smooth to allow direct metallization by ... Qualitative tests show that
the aerogels can be sealed from subsequent semiconductor process liquids so
that ...
Page 271
Volume Resistivity and Dielectric Strength The dielectric conductivity ( o ) of
aerogels is obtained from our microwave measurements by using the ... For dry
silica aerogel with a density of 100 kg / m3 , the dielectric conductivity ranges
from 1 .
Volume Resistivity and Dielectric Strength The dielectric conductivity ( o ) of
aerogels is obtained from our microwave measurements by using the ... For dry
silica aerogel with a density of 100 kg / m3 , the dielectric conductivity ranges
from 1 .
What people are saying - Write a review
We haven't found any reviews in the usual places.
Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
17 other sections not shown
Other editions - View all
Common terms and phrases
absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers