Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
From inside the book
Results 1-3 of 13
Page 125
... Aerogel samples are softer and not as stiff as thermal oxide by more than one order of magnitude . Moreover , organic polymers creep , but thermal oxide and aerogels do not . Crosslinking can harden organic polymers and increase their ...
... Aerogel samples are softer and not as stiff as thermal oxide by more than one order of magnitude . Moreover , organic polymers creep , but thermal oxide and aerogels do not . Crosslinking can harden organic polymers and increase their ...
Page 268
... AEROGELS Silica aerogels have intrinsically low dielectric permittivity for the following reasons : • · they are intrinsically porous because of their formation by sol - gel chemistry they consist of two interconnecting phases , both of ...
... AEROGELS Silica aerogels have intrinsically low dielectric permittivity for the following reasons : • · they are intrinsically porous because of their formation by sol - gel chemistry they consist of two interconnecting phases , both of ...
Page 269
... aerogels gives them the intrinsically low dielectric properties associated with the gas phase . This still seems to be the case even when water adsorbs on the large internal surface area of the aerogel and affects the dielectric ...
... aerogels gives them the intrinsically low dielectric properties associated with the gas phase . This still seems to be the case even when water adsorbs on the large internal surface area of the aerogel and affects the dielectric ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
21 other sections not shown
Other editions - View all
Common terms and phrases
1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch