Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 72
One approach to achieve the required properties is to make copolymers , in
particular alternating copolymers of rodlike and flexible homopolymers . In this
study , several alternating copolyimide precursors were synthesized and
thermally ...
One approach to achieve the required properties is to make copolymers , in
particular alternating copolymers of rodlike and flexible homopolymers . In this
study , several alternating copolyimide precursors were synthesized and
thermally ...
Page 76
10 Therefore , from the WAXD results it is suggested that the alternating PMDA -
BPDA / PDA copolyimide molecules are in a frozen smectic - A like crystalline
state . The random PMDA - BPDA / PDA copolyimide showed transmission and ...
10 Therefore , from the WAXD results it is suggested that the alternating PMDA -
BPDA / PDA copolyimide molecules are in a frozen smectic - A like crystalline
state . The random PMDA - BPDA / PDA copolyimide showed transmission and ...
Page 77
copolyimide , these alternating copolyimides exhibited the ( 006 ) diffraction on
the reflection pattern even though the diffraction peak was weak and broad .
These indicate that their molecular chain order and in - plane orientation are
relatively ...
copolyimide , these alternating copolyimides exhibited the ( 006 ) diffraction on
the reflection pattern even though the diffraction peak was weak and broad .
These indicate that their molecular chain order and in - plane orientation are
relatively ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers