Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A. |
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Page 74
These alternating copolyimide precursor products consist of two different types of linkages , amic isopropyl ester and amic acid which were originated from the new diamine monomer and the conventional amine - anhydride condensation ...
These alternating copolyimide precursor products consist of two different types of linkages , amic isopropyl ester and amic acid which were originated from the new diamine monomer and the conventional amine - anhydride condensation ...
Page 76
10 Therefore , from the WAXD results it is suggested that the alternating PMDA - BPDA / PDA copolyimide molecules are in a frozen smectic - A like crystalline state . The random PMDA - BPDA / PDA copolyimide showed transmission and ...
10 Therefore , from the WAXD results it is suggested that the alternating PMDA - BPDA / PDA copolyimide molecules are in a frozen smectic - A like crystalline state . The random PMDA - BPDA / PDA copolyimide showed transmission and ...
Page 77
0 o copolyimide , these alternating copolyimides exhibited the ( 006 ) diffraction on the reflection pattern even though the diffraction peak was weak and broad . These indicate that their molecular chain order and in - plane ...
0 o copolyimide , these alternating copolyimides exhibited the ( 006 ) diffraction on the reflection pattern even though the diffraction peak was weak and broad . These indicate that their molecular chain order and in - plane ...
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Contents
VaMethods | 3 |
Fluorinated Low Thermal Expansion Coefficient Polyimides | 19 |
Investigations of the Low Dielectric Constant Fluorinated | 31 |
Copyright | |
21 other sections not shown
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce requirements Research resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal stability thickness thin films values vapor various Volume wafer
Bibliographic information
| Title | Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A. Materials Research Society symposia proceedings, ISSN 0272-9172 Volume 381 of Materials Research Society: Materials Research Society symposia proceedings |
| Editor | Toh-Ming Lu |
| Publisher | Materials Research Society, 1995 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 1558992847, 9781558992849 |
| Length | 288 pages |
| Subjects | › › Technology & Engineering / Electronics / General |
| Export Citation | BiBTeX EndNote RefMan |