Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 74
... alternating copolyimide precursor products consist of two different types of linkages , amic isopropyl ester and ... alternating copolyimide precursors are hydrolytically more stable and more soluble in solvents , due to the contribution ...
... alternating copolyimide precursor products consist of two different types of linkages , amic isopropyl ester and ... alternating copolyimide precursors are hydrolytically more stable and more soluble in solvents , due to the contribution ...
Page 76
... alternating PMDA - BPDA / PDA copolyimide molecules are in a frozen smectic - A like crystalline state . The random PMDA - BPDA / PDA copolyimide showed ... copolyimide , these alternating copolyimides exhibited the ( 006 ) 76 76.
... alternating PMDA - BPDA / PDA copolyimide molecules are in a frozen smectic - A like crystalline state . The random PMDA - BPDA / PDA copolyimide showed ... copolyimide , these alternating copolyimides exhibited the ( 006 ) 76 76.
Page 77
... copolyimide , these alternating copolyimides exhibited the ( 006 ) diffraction on the reflection pattern even though ... alternating PMDA- BPDA / PDA copolyimide . For alternating PMDA - BTDA / PDA copolyimide , the projected length of ...
... copolyimide , these alternating copolyimides exhibited the ( 006 ) diffraction on the reflection pattern even though ... alternating PMDA- BPDA / PDA copolyimide . For alternating PMDA - BTDA / PDA copolyimide , the projected length of ...
Contents
Methods | 3 |
Fluorinated Low Thermal Expansion Coefficient Polyimides | 19 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured decrease density device dielectric film dielectric properties electrode electromigration FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film solvent spin-coated spin-on stress substrate surface Table technique Technology TEOS/O test structure thermal stability thin films ULSI vapor deposition wet etch