Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 19
... analysis to ascertain the glass transition temperature and the mechanical modulus at temperatures in excess of the glass transition . INTRODUCTION Over the past several years we have been reporting our work in the area of fluorinated ...
... analysis to ascertain the glass transition temperature and the mechanical modulus at temperatures in excess of the glass transition . INTRODUCTION Over the past several years we have been reporting our work in the area of fluorinated ...
Page 57
... analysis ( TGA ) studies in nitrogen and air are presented in Table 2. The temperature at which a 10 % weight loss occurs gives an approximate measure of the thermal stability of these polymers . The data shown in Table 3 leads to ...
... analysis ( TGA ) studies in nitrogen and air are presented in Table 2. The temperature at which a 10 % weight loss occurs gives an approximate measure of the thermal stability of these polymers . The data shown in Table 3 leads to ...
Page 66
... analysis ( TGA ) of nominally 10μm thick films was conducted in a nitrogen ambient using a thermal gradient of 2.5 ° C / minute . Under these conditions , we observed the onset of decomposition ( as defined by the intersection of the ...
... analysis ( TGA ) of nominally 10μm thick films was conducted in a nitrogen ambient using a thermal gradient of 2.5 ° C / minute . Under these conditions , we observed the onset of decomposition ( as defined by the intersection of the ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch