Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 8
... applications [ 15 ] and is actively being researched for ILD applications [ 16 ] . SPIN - ON ORGANIC FILMS Most of the work on organic dielectric is based on spin - on films . For example , a wide variety of polyimide ( PI ) films are ...
... applications [ 15 ] and is actively being researched for ILD applications [ 16 ] . SPIN - ON ORGANIC FILMS Most of the work on organic dielectric is based on spin - on films . For example , a wide variety of polyimide ( PI ) films are ...
Page 17
... applications . ACKNOWLEDGMENTS This is an industrial wide project . It is impossible to acknowledge all the ... Applications , 517 ( 1994 ) . C.H. Ting , et al . , Advanced Metallization for ULSI Applications , 49 ( 1994 ) . J ...
... applications . ACKNOWLEDGMENTS This is an industrial wide project . It is impossible to acknowledge all the ... Applications , 517 ( 1994 ) . C.H. Ting , et al . , Advanced Metallization for ULSI Applications , 49 ( 1994 ) . J ...
Page 19
... APPLICATIONS : THERMAL STABILITY , REFRACTIVE INDEX AND HIGH TEMPERATURE MODULUS MEASUREMENTS BRIAN C. AUMAN DuPont Electronic Materials , Experimental Station , E334 / 27 , Wilmington , DE 19880 ABSTRACT The mechanical , thermal ...
... APPLICATIONS : THERMAL STABILITY , REFRACTIVE INDEX AND HIGH TEMPERATURE MODULUS MEASUREMENTS BRIAN C. AUMAN DuPont Electronic Materials , Experimental Station , E334 / 27 , Wilmington , DE 19880 ABSTRACT The mechanical , thermal ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch