Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 55
These results suggested that this system might be directly useful as a spin - on
low dielectric constant coating . However , when the same monomer -
photoinitiator solutions were spun onto either bare silicon wafers or aluminum
coated wafers ...
These results suggested that this system might be directly useful as a spin - on
low dielectric constant coating . However , when the same monomer -
photoinitiator solutions were spun onto either bare silicon wafers or aluminum
coated wafers ...
Page 63
The coating thicknesses were determined with a NanoSpec AFTTM Ten to
thirteen measurements were taken on each wafer within one square centimeter ,
and these values were averaged . The films obtained at various spin speeds are
also ...
The coating thicknesses were determined with a NanoSpec AFTTM Ten to
thirteen measurements were taken on each wafer within one square centimeter ,
and these values were averaged . The films obtained at various spin speeds are
also ...
Page 66
We have evaluated the thermal stability of a FLARETM derivative in both free -
standing thin film form and as a coating on silicon substrates using a variety of
techniques . Thermogravimetric analysis ( TGA ) of nominally 10um thick films
was ...
We have evaluated the thermal stability of a FLARETM derivative in both free -
standing thin film form and as a coating on silicon substrates using a variety of
techniques . Thermogravimetric analysis ( TGA ) of nominally 10um thick films
was ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers