Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 80
The foams are prepared from block copolymers consisting of thermally stable and
thermally labile blocks , the latter ... It is important that the initial block copolymer
morphology is in the desired size and shape of the foamed structure that is ...
The foams are prepared from block copolymers consisting of thermally stable and
thermally labile blocks , the latter ... It is important that the initial block copolymer
morphology is in the desired size and shape of the foamed structure that is ...
Page 82
Polyimide - co - poly ( propylene oxide ) triblock copolymers : Poly ( alkyl ester )
route Triblock copolymers could also be prepared in a two - stage process in
which the corresponding poly ( amic ethyl ester ) copolymer can be isolated and
...
Polyimide - co - poly ( propylene oxide ) triblock copolymers : Poly ( alkyl ester )
route Triblock copolymers could also be prepared in a two - stage process in
which the corresponding poly ( amic ethyl ester ) copolymer can be isolated and
...
Page 86
Copolymers can also be prepared via the standard two step poly ( amic acid )
route ( Scheme 3 ) . ... Block copolymer containing various amounts of labile
block were obtained though FC , CF30 6FDAm 6FXDA Labile Block Poly (
propylene ...
Copolymers can also be prepared via the standard two step poly ( amic acid )
route ( Scheme 3 ) . ... Block copolymer containing various amounts of labile
block were obtained though FC , CF30 6FDAm 6FXDA Labile Block Poly (
propylene ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers