Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 111
... copper . Several thermoset resins that were predicted to possess the necessary characteristics have been synthesized and studied . These include a copolymer of 1,3,5 - tris ( 2 - allyloxy - hexafluoro - 2 - propyl ) benzene with ...
... copper . Several thermoset resins that were predicted to possess the necessary characteristics have been synthesized and studied . These include a copolymer of 1,3,5 - tris ( 2 - allyloxy - hexafluoro - 2 - propyl ) benzene with ...
Page 178
... COPPER INTERCONNECT TECHNOLOGY OVERVIEW A brief overview of copper interconnect technology is best contrasted with leading - edge aluminum interconnect technology . We assume that all advanced interconnect alternatives will include ...
... COPPER INTERCONNECT TECHNOLOGY OVERVIEW A brief overview of copper interconnect technology is best contrasted with leading - edge aluminum interconnect technology . We assume that all advanced interconnect alternatives will include ...
Page 183
... Copper CMP is basically a two - step process of mechanical abrasion of the copper surface followed by removal of the abraded material from the vicinity of the surface . The abraded material can be copper , copper oxides or even other ...
... Copper CMP is basically a two - step process of mechanical abrasion of the copper surface followed by removal of the abraded material from the vicinity of the surface . The abraded material can be copper , copper oxides or even other ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch