Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 178
COPPER INTERCONNECT TECHNOLOGY OVERVIEW A brief overview of
copper interconnect technology is best contrasted with leading-edge aluminum
interconnect technology. We assume that all advanced interconnect alternatives
will ...
COPPER INTERCONNECT TECHNOLOGY OVERVIEW A brief overview of
copper interconnect technology is best contrasted with leading-edge aluminum
interconnect technology. We assume that all advanced interconnect alternatives
will ...
Page 178
COPPER INTERCONNECT TECHNOLOGY OVERVIEW A brief overview of
copper interconnect technology is best contrasted with leading - edge aluminum
interconnect technology . We assume that all advanced interconnect alternatives
will ...
COPPER INTERCONNECT TECHNOLOGY OVERVIEW A brief overview of
copper interconnect technology is best contrasted with leading - edge aluminum
interconnect technology . We assume that all advanced interconnect alternatives
will ...
Page 185
Of the techniques described above , dissolution of the abraded material by
increasing the solubility and dissolution rate into the slurry has been most
successful in our work with copper . We have also observed abraded material on
the pad ...
Of the techniques described above , dissolution of the abraded material by
increasing the solubility and dissolution rate into the slurry has been most
successful in our work with copper . We have also observed abraded material on
the pad ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers