Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 26
... curve , or the maximum in the tan & curve are also listed in Table VI . These values are very high for organic polymers and are close to processing temperatures for metallization . Figures 4-8 are DMA curves for the samples . For the ...
... curve , or the maximum in the tan & curve are also listed in Table VI . These values are very high for organic polymers and are close to processing temperatures for metallization . Figures 4-8 are DMA curves for the samples . For the ...
Page 142
... curve of a 7.7 μm thick free standing BPDA - PDA polyimide film at various temperatures . The stress - strain curve is approximately linear when the elongation is smaller than 0.5 % . At higher temperature , the Young's modulus reduces ...
... curve of a 7.7 μm thick free standing BPDA - PDA polyimide film at various temperatures . The stress - strain curve is approximately linear when the elongation is smaller than 0.5 % . At higher temperature , the Young's modulus reduces ...
Page 144
... curve of BPDA - PDA polyimide film . 400 300 200 100 0 0 20 40 25 ° C 100 ° C 200 ° C 300 ° C 400 ° C 60 80 Elongation ( % ) Fig.4 Stress vs. elongation curve of PMDA - ODA polyimide film . TABLES Table 1 : Mechanical properties of BPDA ...
... curve of BPDA - PDA polyimide film . 400 300 200 100 0 0 20 40 25 ° C 100 ° C 200 ° C 300 ° C 400 ° C 60 80 Elongation ( % ) Fig.4 Stress vs. elongation curve of PMDA - ODA polyimide film . TABLES Table 1 : Mechanical properties of BPDA ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch