Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 165
In general , DVS - bisBCB thin films are easily produced defect free with a high
degree of planarization . ... Examples of features found in defective coatings
made intentionally by a process to generate several common thin film defects are
...
In general , DVS - bisBCB thin films are easily produced defect free with a high
degree of planarization . ... Examples of features found in defective coatings
made intentionally by a process to generate several common thin film defects are
...
Page 167
Wafers were held and visually inspected at arms length under a mercury lamp at
254 and 365 nm to find defective wafers . Optical ... This study evaluated coatings
made intentionally by a process to generate several common thin film defects .
Wafers were held and visually inspected at arms length under a mercury lamp at
254 and 365 nm to find defective wafers . Optical ... This study evaluated coatings
made intentionally by a process to generate several common thin film defects .
Page 233
It is pointed out that during our evaluations of the polymer surface we invariably
found defects on the polished surface of the spun on polymers ( BCB and FP ) .
These defects are shown in figure 5 . Fig . 5 : Pinhole defect ( a ) and water ...
It is pointed out that during our evaluations of the polymer surface we invariably
found defects on the polished surface of the spun on polymers ( BCB and FP ) .
These defects are shown in figure 5 . Fig . 5 : Pinhole defect ( a ) and water ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers