Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A. |
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Page 3
In addition , their impact on process integration , fabrication cost and device reliability must also be considered . ... INTRODUCTION The growth of the IC technology is primarily based on the continued scaling of devices to ever ...
In addition , their impact on process integration , fabrication cost and device reliability must also be considered . ... INTRODUCTION The growth of the IC technology is primarily based on the continued scaling of devices to ever ...
Page 4
The switching delay of transistors improves with smaller device dimensions , however , circuit delay also includes the time delay of long interconnection between circuits . The interconnect delay is getting proportionally more important ...
The switching delay of transistors improves with smaller device dimensions , however , circuit delay also includes the time delay of long interconnection between circuits . The interconnect delay is getting proportionally more important ...
Page 79
High performance polymers , such as polyimides , have found a number of uses in a variety of devices and components . ... In a microelectronic device , the propagation velocity of a pulsed signal , V , is inversely proportional to the ...
High performance polymers , such as polyimides , have found a number of uses in a variety of devices and components . ... In a microelectronic device , the propagation velocity of a pulsed signal , V , is inversely proportional to the ...
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Contents
VaMethods | 3 |
Fluorinated Low Thermal Expansion Coefficient Polyimides | 19 |
Investigations of the Low Dielectric Constant Fluorinated | 31 |
Copyright | |
21 other sections not shown
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Common terms and phrases
absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce requirements Research resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal stability thickness thin films values vapor various Volume wafer
Bibliographic information
| Title | Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A. Materials Research Society symposia proceedings, ISSN 0272-9172 Volume 381 of Materials Research Society: Materials Research Society symposia proceedings |
| Editor | Toh-Ming Lu |
| Publisher | Materials Research Society, 1995 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 1558992847, 9781558992849 |
| Length | 288 pages |
| Subjects | › › Technology & Engineering / Electronics / General |
| Export Citation | BiBTeX EndNote RefMan |