Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 94
Also, a copolymer using a polyimide backbone instead of PPQ led to a foamed
polyimide structure with improved dielectric properties after the thermally-labile
groups have been degraded5. The purpose of the present paper is to discuss the
...
Also, a copolymer using a polyimide backbone instead of PPQ led to a foamed
polyimide structure with improved dielectric properties after the thermally-labile
groups have been degraded5. The purpose of the present paper is to discuss the
...
Page 135
DIELECTRIC PROPERTIES OF LOW DIELECTRIC CONSTANT POLYMERIC
MATERIALS Flora S . Ip * and Chiu Ting * * SEMATECH 2706 Montopolis Dr . ,
Austin TX 78741 * On Assignment from Advanced Micro Devices , Austin , TX * *
On ...
DIELECTRIC PROPERTIES OF LOW DIELECTRIC CONSTANT POLYMERIC
MATERIALS Flora S . Ip * and Chiu Ting * * SEMATECH 2706 Montopolis Dr . ,
Austin TX 78741 * On Assignment from Advanced Micro Devices , Austin , TX * *
On ...
Page 267
For example , aerogels have the lowest measured thermal conductivity and
dielectric constant for any solid material . The intrinsically low dielectric properties
of silica aerogels are the direct result of the extremely high achievable porosities
...
For example , aerogels have the lowest measured thermal conductivity and
dielectric constant for any solid material . The intrinsically low dielectric properties
of silica aerogels are the direct result of the extremely high achievable porosities
...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers