Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 130
... elastic or elastic- perfectly plastic , while in reality they will be visco - elastic or visco - elastic - plastic . Finally , in this study dielectric properties are assumed to be isotropic , but it is expected that in - plane and out ...
... elastic or elastic- perfectly plastic , while in reality they will be visco - elastic or visco - elastic - plastic . Finally , in this study dielectric properties are assumed to be isotropic , but it is expected that in - plane and out ...
Page 131
... elastic and elastic - perfectly plastic ( yield strength of 100 MPa ) dielectric , each with elastic moduli of the dielectric of 120 GPa and 30 GPa . Again , these are purely theoretical properties , in the expected range of properties ...
... elastic and elastic - perfectly plastic ( yield strength of 100 MPa ) dielectric , each with elastic moduli of the dielectric of 120 GPa and 30 GPa . Again , these are purely theoretical properties , in the expected range of properties ...
Page 133
... elastic Modulus - 30 , elastic Modulus = 120 , plastic Modulus - 30 , plastic 0 0 10 20 30 40 50 60 70 Dielectric Thermal Expansion Coeffient ( 10 ^ -6 / C ) Figure 12. Hydrostatic component of thermal stress in metal line modulus of ...
... elastic Modulus - 30 , elastic Modulus = 120 , plastic Modulus - 30 , plastic 0 0 10 20 30 40 50 60 70 Dielectric Thermal Expansion Coeffient ( 10 ^ -6 / C ) Figure 12. Hydrostatic component of thermal stress in metal line modulus of ...
Contents
Methods | 3 |
Fluorinated Low Thermal Expansion Coefficient Polyimides | 19 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured decrease density device dielectric film dielectric properties electrode electromigration FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film solvent spin-coated spin-on stress substrate surface Table technique Technology TEOS/O test structure thermal stability thin films ULSI vapor deposition wet etch