Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 31
... electrical properties , processing ( to form ILD ) , and applicability of a DuPont fluorinated polyimide are ... electrical and thermal properties of the DuPont Fluorinated polyimide . In this paper , we report results of our ...
... electrical properties , processing ( to form ILD ) , and applicability of a DuPont fluorinated polyimide are ... electrical and thermal properties of the DuPont Fluorinated polyimide . In this paper , we report results of our ...
Page 162
... Electrical design technology for low dielectric constant multilayer ceramic substrate , " IEEE Trans . Components , Hybrids , and Manufacturing Technology , vol . 15 , pp . 56-62 , February 1992 . [ 4 ] I. Bahl and K. Ely , " Modern ...
... Electrical design technology for low dielectric constant multilayer ceramic substrate , " IEEE Trans . Components , Hybrids , and Manufacturing Technology , vol . 15 , pp . 56-62 , February 1992 . [ 4 ] I. Bahl and K. Ely , " Modern ...
Page 223
... Electrical Feasibility The use of polyimide for ILD and passivation was evaluated through unit process development of several steps : ( 1 ) Polyimide coat / cure process over patterned M1 to evaluate adhesion and leakage currents , ( 2 ) ...
... Electrical Feasibility The use of polyimide for ILD and passivation was evaluated through unit process development of several steps : ( 1 ) Polyimide coat / cure process over patterned M1 to evaluate adhesion and leakage currents , ( 2 ) ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch