Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 14
... electromigration and stress migration , trapped charge or mobile ions , hot electron degradation , etc. Even the measurement of these effects , such as electromigration and stress migration , are subject to different interpretations ...
... electromigration and stress migration , trapped charge or mobile ions , hot electron degradation , etc. Even the measurement of these effects , such as electromigration and stress migration , are subject to different interpretations ...
Page 178
... electromigration compared to aluminum - copper alloys in planar test structures ( nearly two orders of magnitude better than elemental aluminum ) . Reported results indicate more than an order of magnitude better electromigration with ...
... electromigration compared to aluminum - copper alloys in planar test structures ( nearly two orders of magnitude better than elemental aluminum ) . Reported results indicate more than an order of magnitude better electromigration with ...
Page 226
... electromigration structures for comparison of polyimide coated and SiO2 ( control ) coated structures . An experiment was designed to examine the effects of : ( 1 ) the presence or absence of PEN liner on top of M1 and ( 2 ) polyimide ...
... electromigration structures for comparison of polyimide coated and SiO2 ( control ) coated structures . An experiment was designed to examine the effects of : ( 1 ) the presence or absence of PEN liner on top of M1 and ( 2 ) polyimide ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch