Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 59
The search for alternative polymers which incorporate the “ good ” characteristics
of polyimides while exhibiting ... Fluorinated poly ( arylethers ) based on
decafluorobiphenyl exhibit thermal stability comparable to polyimides , from ten
to forty ...
The search for alternative polymers which incorporate the “ good ” characteristics
of polyimides while exhibiting ... Fluorinated poly ( arylethers ) based on
decafluorobiphenyl exhibit thermal stability comparable to polyimides , from ten
to forty ...
Page 61
12 2004 In addition to organic polymers , many of which exhibit dielectric
constants of around 3 , there are at least two other classes of materials currently
under investigation . One class , for which some data were recently presented [
13 ] , is ...
12 2004 In addition to organic polymers , many of which exhibit dielectric
constants of around 3 , there are at least two other classes of materials currently
under investigation . One class , for which some data were recently presented [
13 ] , is ...
Page 62
This class of materials exhibits an excellent combination of thermal stability ,
good electrical properties , and very low moisture ... By varying the nature of the
bisphenols , a large number of polymers can be prepared , exhibiting a wide
range of ...
This class of materials exhibits an excellent combination of thermal stability ,
good electrical properties , and very low moisture ... By varying the nature of the
bisphenols , a large number of polymers can be prepared , exhibiting a wide
range of ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers