Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 96
Also , the last rows of Table II shows that the permittivity is not frequency
dependent between 1 kHz and 10 MHz whereas the loss factor rises from 0 .
0005 to 0 . 008 within the same range of frequencies . Table II . Dielectric
properties of ...
Also , the last rows of Table II shows that the permittivity is not frequency
dependent between 1 kHz and 10 MHz whereas the loss factor rises from 0 .
0005 to 0 . 008 within the same range of frequencies . Table II . Dielectric
properties of ...
Page 121
In the case of back irradiation , most of the high frequency photons get absorbed
before they reach the polyimide film , because the absorption coefficient in silicon
increases with frequency ( 5 ) . The photon flux at the interface for different lamp ...
In the case of back irradiation , most of the high frequency photons get absorbed
before they reach the polyimide film , because the absorption coefficient in silicon
increases with frequency ( 5 ) . The photon flux at the interface for different lamp ...
Page 270
Collectively , these measurements cover a wide frequency range from 10 Hz to
40 GHz and confirm the low permittivity ... We have measured permittivities for
silica aerogels , at microwave frequencies ( i . e . , 2 to 40 GHz ) and at 298K [ 2 ] .
Collectively , these measurements cover a wide frequency range from 10 Hz to
40 GHz and confirm the low permittivity ... We have measured permittivities for
silica aerogels , at microwave frequencies ( i . e . , 2 to 40 GHz ) and at 298K [ 2 ] .
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers