Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 19
... glass transition temperature and the mechanical modulus at temperatures in excess of the glass transition . INTRODUCTION Over the past several years we have been reporting our work in the area of fluorinated polyimides for electronic ...
... glass transition temperature and the mechanical modulus at temperatures in excess of the glass transition . INTRODUCTION Over the past several years we have been reporting our work in the area of fluorinated polyimides for electronic ...
Page 26
... glass transition temperature . Less than an order of magnitude drop is observed at Tg compared to 2 to 3 orders of magnitude typically observed for organic polymers , including many flexible polyimides . So not only is the glass ...
... glass transition temperature . Less than an order of magnitude drop is observed at Tg compared to 2 to 3 orders of magnitude typically observed for organic polymers , including many flexible polyimides . So not only is the glass ...
Page 147
... GLASS TRANSITION TEMPERATURE OF ULTRATHIN POLYMER FILMS ON SILICON WEN - LI WU , WILLIAM E. WALLACE AND JOHN VAN ZANTEN Polymers Division , NIST , Gaithersburg , MD 20899 ABSTRACT The glass transition temperature , T. , of polystyrene ...
... GLASS TRANSITION TEMPERATURE OF ULTRATHIN POLYMER FILMS ON SILICON WEN - LI WU , WILLIAM E. WALLACE AND JOHN VAN ZANTEN Polymers Division , NIST , Gaithersburg , MD 20899 ABSTRACT The glass transition temperature , T. , of polystyrene ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch