Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page vi
... Imaging of Benzocyclobutene ( BCB ) Thin Films on Silicon Wafers 165 Robert A. DeVries , Reed A. Shick , and Bethany K. Johnson PART II : PROCESS INTEGRATION * Low Dielectric Constant Polymers for On - Chip Interlevel Dielectrics with ...
... Imaging of Benzocyclobutene ( BCB ) Thin Films on Silicon Wafers 165 Robert A. DeVries , Reed A. Shick , and Bethany K. Johnson PART II : PROCESS INTEGRATION * Low Dielectric Constant Polymers for On - Chip Interlevel Dielectrics with ...
Page 165
... IMAGING OF BENZOCYCLOBUTENE ( BCB ) THIN FILMS ON SILICON WAFERS Robert A. DeVries , Reed A. Shick , and Bethany K. Johnson The Dow Chemical Company , 677 Bldg , Midland , MI 48667 ABSTRACT A practical , low - cost research system for ...
... IMAGING OF BENZOCYCLOBUTENE ( BCB ) THIN FILMS ON SILICON WAFERS Robert A. DeVries , Reed A. Shick , and Bethany K. Johnson The Dow Chemical Company , 677 Bldg , Midland , MI 48667 ABSTRACT A practical , low - cost research system for ...
Page 169
... Imaging System Components 1. Macintosh IIci personal computer attached to a Tektronics Phaser II color printer 2. IPLab Spectrum TM software ( Signal Analytics Corp. of Vienna , VA ) 3. Star I CCD TM Imaging System from Photometrics Ltd ...
... Imaging System Components 1. Macintosh IIci personal computer attached to a Tektronics Phaser II color printer 2. IPLab Spectrum TM software ( Signal Analytics Corp. of Vienna , VA ) 3. Star I CCD TM Imaging System from Photometrics Ltd ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch