Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A. |
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Page 165
DIGITAL OPTICAL IMAGING OF BENZOCYCLOBUTENE ( BCB ) THIN FILMS ON SILICON WAFERS Robert A. DeVries , Reed A. Shick , and Bethany K. Johnson The Dow Chemical Company , 677 Bldg , Midland , MI 48667 ABSTRACT A practical , low - cost ...
DIGITAL OPTICAL IMAGING OF BENZOCYCLOBUTENE ( BCB ) THIN FILMS ON SILICON WAFERS Robert A. DeVries , Reed A. Shick , and Bethany K. Johnson The Dow Chemical Company , 677 Bldg , Midland , MI 48667 ABSTRACT A practical , low - cost ...
Page 169
Figure 2 : Schematic of Instrumentation for Optical Inspection Black Box CCD Controller T - Mount Adapter UV Light IDE = Stereo Microscope Computer Part Optical Imaging System Components 1. Macintosh IIci personal computer attached to a ...
Figure 2 : Schematic of Instrumentation for Optical Inspection Black Box CCD Controller T - Mount Adapter UV Light IDE = Stereo Microscope Computer Part Optical Imaging System Components 1. Macintosh IIci personal computer attached to a ...
Page 287
... 255 optical imaging , 165 organic dielectric , 3 materials , 117 Oxydianiline ( PMDA - ODA ) , 141 gapfill polymeric materials , 197 gap - filling , 255 glass transition temperature , 147 heterocyclic polymer , 93 highly processible ...
... 255 optical imaging , 165 organic dielectric , 3 materials , 117 Oxydianiline ( PMDA - ODA ) , 141 gapfill polymeric materials , 197 gap - filling , 255 glass transition temperature , 147 heterocyclic polymer , 93 highly processible ...
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Contents
VaMethods | 3 |
Fluorinated Low Thermal Expansion Coefficient Polyimides | 19 |
Investigations of the Low Dielectric Constant Fluorinated | 31 |
Copyright | |
21 other sections not shown
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Common terms and phrases
absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce requirements Research resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal stability thickness thin films values vapor various Volume wafer
Bibliographic information
| Title | Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A. Materials Research Society symposia proceedings, ISSN 0272-9172 Volume 381 of Materials Research Society: Materials Research Society symposia proceedings |
| Editor | Toh-Ming Lu |
| Publisher | Materials Research Society, 1995 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 1558992847, 9781558992849 |
| Length | 288 pages |
| Subjects | › › Technology & Engineering / Electronics / General |
| Export Citation | BiBTeX EndNote RefMan |