Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 165
DIGITAL OPTICAL IMAGING OF BENZOCYCLOBUTENE ( BCB ) THIN FILMS ON
SILICON WAFERS Robert A . DeVries , Reed A . Shick , and Bethany K . Johnson
The Dow Chemical Company , 677 Bldg , Midland , MI 48667 ABSTRACT A ...
DIGITAL OPTICAL IMAGING OF BENZOCYCLOBUTENE ( BCB ) THIN FILMS ON
SILICON WAFERS Robert A . DeVries , Reed A . Shick , and Bethany K . Johnson
The Dow Chemical Company , 677 Bldg , Midland , MI 48667 ABSTRACT A ...
Page 166
BACKGROUND Digital imaging is an emerging technique that can enhance
defect detection , differentiate flaws , provide reproducible images , and give
quantitative as well as qualitative measurements . The technique also allows
digital ...
BACKGROUND Digital imaging is an emerging technique that can enhance
defect detection , differentiate flaws , provide reproducible images , and give
quantitative as well as qualitative measurements . The technique also allows
digital ...
Page 167
Optical images of selected wafers were taken and recorded using the previously
described imaging system using a 39x magnification and are shown in Figures 3
- 5 . RESULTS AND DISCUSSION In general , defect free DVS - bisBCB thin ...
Optical images of selected wafers were taken and recorded using the previously
described imaging system using a 39x magnification and are shown in Figures 3
- 5 . RESULTS AND DISCUSSION In general , defect free DVS - bisBCB thin ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers