Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 80
It is important that the initial block copolymer morphology is in the desired size
and shape of the foamed structure that is eventually desired . Since we are
concerned with generating non - interconnected porous foams with domains in
the ...
It is important that the initial block copolymer morphology is in the desired size
and shape of the foamed structure that is eventually desired . Since we are
concerned with generating non - interconnected porous foams with domains in
the ...
Page 88
The characteristics of a number of polyimide foams is shown in Table 2 . Table 2 .
Characteristics of Polyimide Foams Sample Entry PMDA / 3FDA Polyimide Initial
Labile Block Composition . Vol . % Density ( g / cm ) Volume Fraction of Voids ...
The characteristics of a number of polyimide foams is shown in Table 2 . Table 2 .
Characteristics of Polyimide Foams Sample Entry PMDA / 3FDA Polyimide Initial
Labile Block Composition . Vol . % Density ( g / cm ) Volume Fraction of Voids ...
Page 189
That is , with both BCB and parylene we emphasized initial demonstration of
CMP - based Damascene patterning and delineation of issues . While the results
below are considered promising , additional research is needed to establish the ...
That is , with both BCB and parylene we emphasized initial demonstration of
CMP - based Damascene patterning and delineation of issues . While the results
below are considered promising , additional research is needed to establish the ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers