Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 19
... properties , dielectric constants , *Fluorinated, Low Thermal Expansion Coefficient Polyimides for Interlayer Dielectric Applications: Thermal Stability, Refractive Index and High Temperature Modulus Measurements Auman.
... properties , dielectric constants , *Fluorinated, Low Thermal Expansion Coefficient Polyimides for Interlayer Dielectric Applications: Thermal Stability, Refractive Index and High Temperature Modulus Measurements Auman.
Page 105
... DIELECTRIC CONSTANT FILM FORMATION BY PLASMA FLUORINATION OF HYDROCARBON ... dielectric constants of 2.0 - 2.4 which was close to that of PTFE . However ... interlayer dielectrics using plasma fluorination . INTRODUCTION High - speed ...
... DIELECTRIC CONSTANT FILM FORMATION BY PLASMA FLUORINATION OF HYDROCARBON ... dielectric constants of 2.0 - 2.4 which was close to that of PTFE . However ... interlayer dielectrics using plasma fluorination . INTRODUCTION High - speed ...
Page 239
... dielectric film properties and their formation techniques have to meet the following requirements : ( 1 ) a low dielectric constant , ( 2 ) a high ... Interlayer Dielectrics in Quarter-Micron ULSI Multilevel Interconnections Tetsuya Homma.
... dielectric film properties and their formation techniques have to meet the following requirements : ( 1 ) a low dielectric constant , ( 2 ) a high ... Interlayer Dielectrics in Quarter-Micron ULSI Multilevel Interconnections Tetsuya Homma.
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch