Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 19
FLUORINATED , LOW THERMAL EXPANSION COEFFICIENT POLYIMIDES
FOR INTERLAYER DIELECTRIC APPLICATIONS : THERMAL STABILITY ,
REFRACTIVE INDEX AND HIGH TEMPERATURE MODULUS
MEASUREMENTS BRIAN ...
FLUORINATED , LOW THERMAL EXPANSION COEFFICIENT POLYIMIDES
FOR INTERLAYER DIELECTRIC APPLICATIONS : THERMAL STABILITY ,
REFRACTIVE INDEX AND HIGH TEMPERATURE MODULUS
MEASUREMENTS BRIAN ...
Page 105
Finally , we proposed direct patterning of interlayer dielectrics using plasma
fluorination . INTRODUCTION High - speed integrated circuits ( IC ) have been
revolutionizing microelectronics industries and are forming the backbone of today
' s ...
Finally , we proposed direct patterning of interlayer dielectrics using plasma
fluorination . INTRODUCTION High - speed integrated circuits ( IC ) have been
revolutionizing microelectronics industries and are forming the backbone of today
' s ...
Page 240
The purpose of this paper is to compare the fluorinated Si02 film properties with
each other for the interlayer dielectric application, then the pros and cons of each
technique are explained. The fluorinated SiO2 film properties will also be ...
The purpose of this paper is to compare the fluorinated Si02 film properties with
each other for the interlayer dielectric application, then the pros and cons of each
technique are explained. The fluorinated SiO2 film properties will also be ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers