Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A. |
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Page 24
... 2.5 2.3 6 6FCDA / TFMB 1.58 1.52 0.06 2.5 2.3 10 6FDA / 6FDAm 1.54 1.535 0.005 2.4 2.4 50 Table V Isothermal Weight Loss in Nitrogen of Fluorinated Polyimide Copolymers Polyimide Cure Temp ° C % Wt loss 0-1 hr RT - 375 ° C % Wt loss ...
... 2.5 2.3 6 6FCDA / TFMB 1.58 1.52 0.06 2.5 2.3 10 6FDA / 6FDAm 1.54 1.535 0.005 2.4 2.4 50 Table V Isothermal Weight Loss in Nitrogen of Fluorinated Polyimide Copolymers Polyimide Cure Temp ° C % Wt loss 0-1 hr RT - 375 ° C % Wt loss ...
Page 35
1 -1 The weight loss of the polyimide is monitored by dynamic TGA combined with insitu FTIR by which the decomposed segments can be identified . The initial weight loss of the polyimide started slowly at 250 ° C as shown in Fig . 3.
1 -1 The weight loss of the polyimide is monitored by dynamic TGA combined with insitu FTIR by which the decomposed segments can be identified . The initial weight loss of the polyimide started slowly at 250 ° C as shown in Fig . 3.
Page 57
The temperature at which a 10 % weight loss occurs gives an approximate measure of the thermal stability of these polymers . The data shown in Table 3 leads to several interesting conclusions . First , good thermal stability under both ...
The temperature at which a 10 % weight loss occurs gives an approximate measure of the thermal stability of these polymers . The data shown in Table 3 leads to several interesting conclusions . First , good thermal stability under both ...
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Contents
VaMethods | 3 |
Fluorinated Low Thermal Expansion Coefficient Polyimides | 19 |
Investigations of the Low Dielectric Constant Fluorinated | 31 |
Copyright | |
21 other sections not shown
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Common terms and phrases
absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce requirements Research resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal stability thickness thin films values vapor various Volume wafer
Bibliographic information
| Title | Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A. Materials Research Society symposia proceedings, ISSN 0272-9172 Volume 381 of Materials Research Society: Materials Research Society symposia proceedings |
| Editor | Toh-Ming Lu |
| Publisher | Materials Research Society, 1995 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 1558992847, 9781558992849 |
| Length | 288 pages |
| Subjects | › › Technology & Engineering / Electronics / General |
| Export Citation | BiBTeX EndNote RefMan |