Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 24
3 . 10 6FDA / 6FDAM 1 . 54 1 . 54 1 . 535 1 . 535 0 . 005 0 . 005 2 . 4 2 . 4 2 . 4 2 .
4 50 Table V Isothermal Weight Loss in Nitrogen of Fluorinated Polyimide
Copolymers Polyimide + loss Cure Temp % Wt loss 0 - 1 hr RT - 375 °C % Wt
loss 1 ...
3 . 10 6FDA / 6FDAM 1 . 54 1 . 54 1 . 535 1 . 535 0 . 005 0 . 005 2 . 4 2 . 4 2 . 4 2 .
4 50 Table V Isothermal Weight Loss in Nitrogen of Fluorinated Polyimide
Copolymers Polyimide + loss Cure Temp % Wt loss 0 - 1 hr RT - 375 °C % Wt
loss 1 ...
Page 35
cleare shown an bei dynam cm " , and small amoun a significant The weight loss
of the polyimide is monitored by dynamic TGA combined with insitu FTIR by
which the decomposed segments can be identified . The initial weight loss of the
...
cleare shown an bei dynam cm " , and small amoun a significant The weight loss
of the polyimide is monitored by dynamic TGA combined with insitu FTIR by
which the decomposed segments can be identified . The initial weight loss of the
...
Page 161
The full - sheet resonance method is limited in its ability to determine the loss
factor since the surface area is large relative to volume . ( 12 , 55 , 23 ) . Other
Resonance Methods The permittivity of high - dielectric constant thin films have
been ...
The full - sheet resonance method is limited in its ability to determine the loss
factor since the surface area is large relative to volume . ( 12 , 55 , 23 ) . Other
Resonance Methods The permittivity of high - dielectric constant thin films have
been ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers