Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 89
To obtain a measure of the dielectric anisotropy of the thin films we measure the
refractive index of thin film samples . ... plane and out - of - plane refractive
indices ) and have observed that the measured dielectric constant is
approximately the ...
To obtain a measure of the dielectric anisotropy of the thin films we measure the
refractive index of thin film samples . ... plane and out - of - plane refractive
indices ) and have observed that the measured dielectric constant is
approximately the ...
Page 258
Table III : Stress Values of the Cured SOG films and Their Variation after the
Water Immersion The stress values were estimated by measuring the wafer
curvature . We also measured their variations after one - hour - long immersion of
the ...
Table III : Stress Values of the Cured SOG films and Their Variation after the
Water Immersion The stress values were estimated by measuring the wafer
curvature . We also measured their variations after one - hour - long immersion of
the ...
Page 275
a - tC RESULTS was Dielectric Constant The resistivities of a - tC films measured
from MIM structures exhibit a strong dependence on the laser energy density and
the presence or nature of the gas ambient in the deposition system .
a - tC RESULTS was Dielectric Constant The resistivities of a - tC films measured
from MIM structures exhibit a strong dependence on the laser energy density and
the presence or nature of the gas ambient in the deposition system .
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Contents
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Thermal and Mechanical Properties of Low K Polymers | 123 |
Dielectric Properties of Low Dielectric Constant | 135 |
Copyright | |
16 other sections not shown
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Common terms and phrases
absorption addition adhesion alternating annealing applications block bond bulk capacitance chemical circuit coating compared copolyimide copolymer copper cured decrease density deposition determined device effect electrical electronic etch Figure film thickness fluorinated foamed followed frequency function glass higher improve increase indicate integrated interconnect interlayer dielectric layer loss low dielectric constant lower materials measured mechanical metal method microelectronics modulus moisture monomers observed obtained organic oxide Parylene patterns peak performance permittivity planarization plasma polishing polyimide polyimide film polymer polymerization prepared presented properties range reactor reduce refractive reported requirements Research resistance sample shows silica aerogels silicon SiO2 SOG film solution solvent step stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal stability thickness thin films treatment values vapor Volume wafers weight
Bibliographic information
| Title | Low-dielectric Constant Materials Materials Research Society symposia proceedings |
| Publisher | Materials Research Society, 1995 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 1558992847, 9781558992849 |
| Export Citation | BiBTeX EndNote RefMan |