Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 135
... measurements , and the horizontal ( in - plane ) dielectric properties were determined by intra - line measurements of sub - half micron serpentine and comb test structures . INTRODUCTION 1,2 The use of low dielectric constant polyimide ...
... measurements , and the horizontal ( in - plane ) dielectric properties were determined by intra - line measurements of sub - half micron serpentine and comb test structures . INTRODUCTION 1,2 The use of low dielectric constant polyimide ...
Page 157
... measurements of thin materials in the 10-100 GHz band . Measurements on dielectric thin - film anisotropy are given in [ 37 ] . CAPACITANCE METHODS Capacitance techniques are important at frequencies from 1 Hz to 1 MHz [ 38 , 39 ] . In ...
... measurements of thin materials in the 10-100 GHz band . Measurements on dielectric thin - film anisotropy are given in [ 37 ] . CAPACITANCE METHODS Capacitance techniques are important at frequencies from 1 Hz to 1 MHz [ 38 , 39 ] . In ...
Page 163
... measurements of dissipation factor in microwave printed circuit boards , " IEEE Trans . Instrum . Meas . , vol . IM - 38 , pp . 509-514 , April 1989 . [ 21 ] J. Murray Olyphant and J. H. Ball , " Stripline methods for dielectric ...
... measurements of dissipation factor in microwave printed circuit boards , " IEEE Trans . Instrum . Meas . , vol . IM - 38 , pp . 509-514 , April 1989 . [ 21 ] J. Murray Olyphant and J. H. Ball , " Stripline methods for dielectric ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch