Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 155
These materials are thin and may be clad by copper , making measurements
using closed transmission lines difficult . Also , many of ... The loss tangent is
obtained by measurement of the quality factor , with and without sample . The
real part ...
These materials are thin and may be clad by copper , making measurements
using closed transmission lines difficult . Also , many of ... The loss tangent is
obtained by measurement of the quality factor , with and without sample . The
real part ...
Page 163
[ 20 ] H . Tanaka and F . Okada , “ Precise measurements of dissipation factor in
microwave printed circuit boards , " IEEE Trans . Instrum . Meas . , vol . IM - 38 ,
pp . 509 - 514 , April 1989 . [ 21 ] J . Murray Olyphant and J . H . Ball , “ Stripline ...
[ 20 ] H . Tanaka and F . Okada , “ Precise measurements of dissipation factor in
microwave printed circuit boards , " IEEE Trans . Instrum . Meas . , vol . IM - 38 ,
pp . 509 - 514 , April 1989 . [ 21 ] J . Murray Olyphant and J . H . Ball , “ Stripline ...
Page 270
There are only a few reports of dielectric constant measurements made for thin
silica aerogel films ( 4 , 5 , 6 ) . Dielectric Permittivity Measurements Permittivity
measurements are reported for a variety of sol - gel derived porous silica
materials ...
There are only a few reports of dielectric constant measurements made for thin
silica aerogel films ( 4 , 5 , 6 ) . Dielectric Permittivity Measurements Permittivity
measurements are reported for a variety of sol - gel derived porous silica
materials ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers