Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A. |
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Page 53
RESULTS AND DISCUSSION Synthesis of Monomers The proposed mechanism for the acid catalyzed condensation - ring ... Y-Y A B C -H -Y D E eq.3 Protonation of monomer A results in cation B which undergoes electrophilic attack on monomer to ...
RESULTS AND DISCUSSION Synthesis of Monomers The proposed mechanism for the acid catalyzed condensation - ring ... Y-Y A B C -H -Y D E eq.3 Protonation of monomer A results in cation B which undergoes electrophilic attack on monomer to ...
Page 56
these monomers to produce polymers with indane groups in the backbones . For example , shown in equation 5 is the photopolymerization of monomer 2 . hv He Arzs + x | --23 oct n eq . 6 Aromatic polyimides are widely employed in the ...
these monomers to produce polymers with indane groups in the backbones . For example , shown in equation 5 is the photopolymerization of monomer 2 . hv He Arzs + x | --23 oct n eq . 6 Aromatic polyimides are widely employed in the ...
Page 57
Photopolymerization All of the monomers shown in Table 1 could be photopolymerized by irradiation with UV light in presence of a diaryliodonium or triarylsulfonium salt photoinitiator . 10 Typically , polymerization occurred within ...
Photopolymerization All of the monomers shown in Table 1 could be photopolymerized by irradiation with UV light in presence of a diaryliodonium or triarylsulfonium salt photoinitiator . 10 Typically , polymerization occurred within ...
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Contents
VaMethods | 3 |
Fluorinated Low Thermal Expansion Coefficient Polyimides | 19 |
Investigations of the Low Dielectric Constant Fluorinated | 31 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce requirements Research resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal stability thickness thin films values vapor various Volume wafer
Bibliographic information
| Title | Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A. Materials Research Society symposia proceedings, ISSN 0272-9172 Volume 381 of Materials Research Society: Materials Research Society symposia proceedings |
| Editor | Toh-Ming Lu |
| Publisher | Materials Research Society, 1995 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 1558992847, 9781558992849 |
| Length | 288 pages |
| Subjects | › › Technology & Engineering / Electronics / General |
| Export Citation | BiBTeX EndNote RefMan |