Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 165
DIGITAL OPTICAL IMAGING OF BENZOCYCLOBUTENE ( BCB ) THIN FILMS ON
SILICON WAFERS Robert A . DeVries , Reed A . Shick , and Bethany K . Johnson
The Dow Chemical Company , 677 Bldg , Midland , MI 48667 ABSTRACT A ...
DIGITAL OPTICAL IMAGING OF BENZOCYCLOBUTENE ( BCB ) THIN FILMS ON
SILICON WAFERS Robert A . DeVries , Reed A . Shick , and Bethany K . Johnson
The Dow Chemical Company , 677 Bldg , Midland , MI 48667 ABSTRACT A ...
Page 167
Manual and Optical Inspections in UV Light In diffuse white light thin films of
Cyclotenem resin are transparent to the human eye , but in UV light the resin is
semi - opaque and can be seen directly . Wafers were held and visually
inspected at ...
Manual and Optical Inspections in UV Light In diffuse white light thin films of
Cyclotenem resin are transparent to the human eye , but in UV light the resin is
semi - opaque and can be seen directly . Wafers were held and visually
inspected at ...
Page 256
RESULTS Spin Coat and Cure When we observed the cured film of SOG ( a )
with an optical microscope , we always found striations in the radial direction .
The optical measurement showed the peak to valley height of about 500A . The
other ...
RESULTS Spin Coat and Cure When we observed the cured film of SOG ( a )
with an optical microscope , we always found striations in the radial direction .
The optical measurement showed the peak to valley height of about 500A . The
other ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers