Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
From inside the book
Results 1-3 of 49
Page 10
CVD organic films are , in general , not well understood because they depend on
not only the source materials and chemistry but also on the deposition equipment
and operating conditions used in depositing the film . One widely studied CVD ...
CVD organic films are , in general , not well understood because they depend on
not only the source materials and chemistry but also on the deposition equipment
and operating conditions used in depositing the film . One widely studied CVD ...
Page 60
Organic polymers are , in general , known to exhibit lower dielectric constants
than inorganic oxides and nitrides , and thus may be considered as candidates
for the intermetal dielectric in sub - half micron devices . Organic polymers ...
Organic polymers are , in general , known to exhibit lower dielectric constants
than inorganic oxides and nitrides , and thus may be considered as candidates
for the intermetal dielectric in sub - half micron devices . Organic polymers ...
Page 125
Three groups of materials including thermal oxide and silicon nitride , which are
current ILD materials , organic polymers , and SiO2 Aerogel samples with two
densities , are measured and compared . Figures 6 and 7 are the plots of load vs
...
Three groups of materials including thermal oxide and silicon nitride , which are
current ILD materials , organic polymers , and SiO2 Aerogel samples with two
densities , are measured and compared . Figures 6 and 7 are the plots of load vs
...
What people are saying - Write a review
We haven't found any reviews in the usual places.
Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
17 other sections not shown
Other editions - View all
Common terms and phrases
absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers