Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 32
Electrical Characteristics ( C-V measurements ) To carry out C-V measurements,
the top Cu electrodes are sputtered on the fluorinated polyimide after spinning on
and soft baking the fluorinated polyimide (4000 A) on thin 250 A thermal oxide, ...
Electrical Characteristics ( C-V measurements ) To carry out C-V measurements,
the top Cu electrodes are sputtered on the fluorinated polyimide after spinning on
and soft baking the fluorinated polyimide (4000 A) on thin 250 A thermal oxide, ...
Page 125
Three groups of materials including thermal oxide and silicon nitride , which are
current ILD materials , organic polymers , and SiO2 Aerogel samples with two
densities , are measured and compared . Figures 6 and 7 are the plots of load vs
...
Three groups of materials including thermal oxide and silicon nitride , which are
current ILD materials , organic polymers , and SiO2 Aerogel samples with two
densities , are measured and compared . Figures 6 and 7 are the plots of load vs
...
Page 178
We assume that all advanced interconnect alternatives will include globally
planarized oxides covering the silicon wafer ... After global planarization the
oxide is patterned for contact to the semiconductor devices (and in some cases a
local ...
We assume that all advanced interconnect alternatives will include globally
planarized oxides covering the silicon wafer ... After global planarization the
oxide is patterned for contact to the semiconductor devices (and in some cases a
local ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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Common terms and phrases
absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers