Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 4
... plasma etching . The W- plug is formed by CVD deposition followed by etchback or CMP process . This interconnect structure and fabrication process are illustrated in Fig . 3 . ( 2 ) SiO , / planarized Al : This is similar to ( 1 ) ...
... plasma etching . The W- plug is formed by CVD deposition followed by etchback or CMP process . This interconnect structure and fabrication process are illustrated in Fig . 3 . ( 2 ) SiO , / planarized Al : This is similar to ( 1 ) ...
Page 7
... Plasma Etch - Via Pattern Photoresist Strip TiN Liner Deposition TIN ΑΙ = TIN CVD W Deposition / Etch - back Ti / AI / TIN Conductor Deposition W Photolithography - Conductor Pattern SiO2 SiO2 Plasma Etch - Conductor Pattern Photoresist ...
... Plasma Etch - Via Pattern Photoresist Strip TiN Liner Deposition TIN ΑΙ = TIN CVD W Deposition / Etch - back Ti / AI / TIN Conductor Deposition W Photolithography - Conductor Pattern SiO2 SiO2 Plasma Etch - Conductor Pattern Photoresist ...
Page 10
... etching of via holes , photoresist stripping , etc. , must be carefully ... plasma photoresist stripping process , however , wet photoresist stripper ... etching mask . Via holes are formed in a RIE etcher ( AMT 5000 ) by first etching ...
... etching of via holes , photoresist stripping , etc. , must be carefully ... plasma photoresist stripping process , however , wet photoresist stripper ... etching mask . Via holes are formed in a RIE etcher ( AMT 5000 ) by first etching ...
Contents
Methods | 3 |
Fluorinated Low Thermal Expansion Coefficient Polyimides | 19 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured decrease density device dielectric film dielectric properties electrode electromigration FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film solvent spin-coated spin-on stress substrate surface Table technique Technology TEOS/O test structure thermal stability thin films ULSI vapor deposition wet etch