Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 130
... plastic , while in reality they will be visco - elastic or visco - elastic - plastic . Finally , in this study dielectric properties are assumed to be isotropic , but it is expected that in - plane and out - of - plane properties could ...
... plastic , while in reality they will be visco - elastic or visco - elastic - plastic . Finally , in this study dielectric properties are assumed to be isotropic , but it is expected that in - plane and out - of - plane properties could ...
Page 131
... plastic ( yield strength of 100 MPa ) dielectric , each with elastic moduli of the dielectric of 120 GPa and 30 GPa . Again , these are purely theoretical properties , in the expected range of properties for low K dielectric materials ...
... plastic ( yield strength of 100 MPa ) dielectric , each with elastic moduli of the dielectric of 120 GPa and 30 GPa . Again , these are purely theoretical properties , in the expected range of properties for low K dielectric materials ...
Page 133
... plastic Modulus - 30 , plastic 0 0 10 20 30 40 50 60 70 Dielectric Thermal Expansion Coeffient ( 10 ^ -6 / C ) Figure 12. Hydrostatic component of thermal stress in metal line modulus of the dielectric , increasing its thermal expansion ...
... plastic Modulus - 30 , plastic 0 0 10 20 30 40 50 60 70 Dielectric Thermal Expansion Coeffient ( 10 ^ -6 / C ) Figure 12. Hydrostatic component of thermal stress in metal line modulus of the dielectric , increasing its thermal expansion ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch