Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 102
Table IV shows that the inherent viscosity of the polymers increased as a function
of the excess of TBDC . ... of the polybenzhydrolimide but also with the terminal
amine groups of the polymer according to the mechanism illustrated in Figure 6 .
Table IV shows that the inherent viscosity of the polymers increased as a function
of the excess of TBDC . ... of the polybenzhydrolimide but also with the terminal
amine groups of the polymer according to the mechanism illustrated in Figure 6 .
Page 189
CMP and DAMASCENE PATTERNING WITH BCB AND PARYLENE ILDs With
CMP - based patterning in a Damascene process , two properties of polymers
compared to oxides are particularly challenging : first , polymer thin films are soft
and ...
CMP and DAMASCENE PATTERNING WITH BCB AND PARYLENE ILDs With
CMP - based patterning in a Damascene process , two properties of polymers
compared to oxides are particularly challenging : first , polymer thin films are soft
and ...
Page 231
1 , there is an initial compression of the polymer leading to a decrease in
thickness . However a relaxation occurs with time , and the compression is
completely removed after a maximum of 10 minutes . Since at least 60 minutes
passed ...
1 , there is an initial compression of the polymer leading to a decrease in
thickness . However a relaxation occurs with time , and the compression is
completely removed after a maximum of 10 minutes . Since at least 60 minutes
passed ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers