Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 262
... Porosity 0.9 Figure 1 Variation of dielectric constant with porosity . Experimental data from [ 5 ] . In addition to ... porous solid . The average pore diameter ( the hydraulic diameter which is 4pore volume / surface area , 4V / A ̧ ) ...
... Porosity 0.9 Figure 1 Variation of dielectric constant with porosity . Experimental data from [ 5 ] . In addition to ... porous solid . The average pore diameter ( the hydraulic diameter which is 4pore volume / surface area , 4V / A ̧ ) ...
Page 268
... porous because of their formation by sol - gel chemistry they consist of two interconnecting phases , both of which ... porosity ; that is , their structure is formed from molecular sized clusters which themselves have microporosity ...
... porous because of their formation by sol - gel chemistry they consist of two interconnecting phases , both of which ... porosity ; that is , their structure is formed from molecular sized clusters which themselves have microporosity ...
Page 272
... porous dielectric materials References : 1. A.R. von Hippel , Dielectric and Waves , ( J.Wiley and Sons , New York , 1954 ) , p . 28 . 2. L.W. Hrubesh , L.E. Keene , and V.R. Latorre , J. Mater . Res . 8 , 1736 ( 1993 ) . 3. C.J. ...
... porous dielectric materials References : 1. A.R. von Hippel , Dielectric and Waves , ( J.Wiley and Sons , New York , 1954 ) , p . 28 . 2. L.W. Hrubesh , L.E. Keene , and V.R. Latorre , J. Mater . Res . 8 , 1736 ( 1993 ) . 3. C.J. ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch