Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 82
... precipitated into 800 mL of hexane , washed 2X in water / methanol , filtered and vacuum dried to constant weight to yield 4.8 g of polymer . Polyimide - co - poly ( propylene oxide ) triblock copolymers : Poly ( alkyl ester ) route ...
... precipitated into 800 mL of hexane , washed 2X in water / methanol , filtered and vacuum dried to constant weight to yield 4.8 g of polymer . Polyimide - co - poly ( propylene oxide ) triblock copolymers : Poly ( alkyl ester ) route ...
Page 98
... precipitated into deionized water , and dried at 200 ̊C under reduced pressure . The glass transition temperatures of the three cardo - polyimides , measured by thermomechanical analysis , were 358 , 361 , and upper than 400 ° C for ...
... precipitated into deionized water , and dried at 200 ̊C under reduced pressure . The glass transition temperatures of the three cardo - polyimides , measured by thermomechanical analysis , were 358 , 361 , and upper than 400 ° C for ...
Page 99
... precipitate which was washed three times with methanol and then with water . The powdered polyimide was finally dried at 170 ° C in a vacuum oven for 48 hours . Discussion The solutions of polyimides in meta - cresol at 20 wt ...
... precipitate which was washed three times with methanol and then with water . The powdered polyimide was finally dried at 170 ° C in a vacuum oven for 48 hours . Discussion The solutions of polyimides in meta - cresol at 20 wt ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch