Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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This volume contains papers presented at the first Materials Research Society
symposium on low - dielectric thin films for microelectronics applications . The
symposium focuses on the synthesis , deposition , and characterization of low ...
This volume contains papers presented at the first Materials Research Society
symposium on low - dielectric thin films for microelectronics applications . The
symposium focuses on the synthesis , deposition , and characterization of low ...
Page 29
B . C . Auman , presented at the First International Conference on Dielectrics and
CMP for VLSI / ULSI Multilevel Interconnection , Feb . 20 - 22 , 1995 , Santa Clara
, CA , Proceedings Booklet p . 297 . J . Leu , J . K . Lee , J . Kasthurirangan , C ...
B . C . Auman , presented at the First International Conference on Dielectrics and
CMP for VLSI / ULSI Multilevel Interconnection , Feb . 20 - 22 , 1995 , Santa Clara
, CA , Proceedings Booklet p . 297 . J . Leu , J . K . Lee , J . Kasthurirangan , C ...
Page 260
We also thank Kelly Taylor for reading the manuscript carefully . References 1 . T
. Nakano , presented at Symposium " Interlayer Dielectrics Processing to
Fabricate Multilevel Metallization Applied for the Next Generation ULSI " , Tokyo ,
Japan ...
We also thank Kelly Taylor for reading the manuscript carefully . References 1 . T
. Nakano , presented at Symposium " Interlayer Dielectrics Processing to
Fabricate Multilevel Metallization Applied for the Next Generation ULSI " , Tokyo ,
Japan ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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Common terms and phrases
absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers