Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 102
... ratio TBDC / polyimide and the viscosity Molar ratio TBDC / polyimide Inherent viscosity ( dl g1 ) 1.0 0.49 1.3 0.48 1.4 0.98 1.5 1.20 Discussion These results suggest that the ditertiobutyl dicarbonate react not only with the hydroxyl ...
... ratio TBDC / polyimide and the viscosity Molar ratio TBDC / polyimide Inherent viscosity ( dl g1 ) 1.0 0.49 1.3 0.48 1.4 0.98 1.5 1.20 Discussion These results suggest that the ditertiobutyl dicarbonate react not only with the hydroxyl ...
Page 183
... ratio must have a high dissolution rate into the slurry while the surface film in the recessed area must have a very low dissolution rate . In order to fully dissolve the abraded material , the solubility of copper in the slurry and the ...
... ratio must have a high dissolution rate into the slurry while the surface film in the recessed area must have a very low dissolution rate . In order to fully dissolve the abraded material , the solubility of copper in the slurry and the ...
Page 253
... ratio was different between the films , as shown in figure 3. The data were taken from the total integrated XPS ... ratio . Thus the higher F / C ratio in the helicon reactor with CF , than that in the parallel - plate reactor shown in ...
... ratio was different between the films , as shown in figure 3. The data were taken from the total integrated XPS ... ratio . Thus the higher F / C ratio in the helicon reactor with CF , than that in the parallel - plate reactor shown in ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch