Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 60
... relative influence of insulators with different dielectric constants on circuit performance [ 3a , b ] , but it is rather difficult to correlate a required dielectric constant with a specific device . For example it has been pointed out ...
... relative influence of insulators with different dielectric constants on circuit performance [ 3a , b ] , but it is rather difficult to correlate a required dielectric constant with a specific device . For example it has been pointed out ...
Page 67
... relative humidity ) , a FLARE TM derivative showed little change when the capacitor structure was equilibrated at 0 % and 60 % relative humidity , respectively . In the case of FLARETM , the dielectric constant only increased from 2.62 ...
... relative humidity ) , a FLARE TM derivative showed little change when the capacitor structure was equilibrated at 0 % and 60 % relative humidity , respectively . In the case of FLARETM , the dielectric constant only increased from 2.62 ...
Page 265
... ( relative ) ( g / cm3 ) ( nm ) 0 0.422 9.4 8.8 0.007 0.336 12.4 9.0 0.01 0.317 13.2 9.2 0.02 0.293 14.2 0.03 0.188 25.4 16.6 0.05 0.190 26.0 0.1 0.163 32.6 16.3 0.2 0.165 31.6 Table 2 An approach for probing structure which does not ...
... ( relative ) ( g / cm3 ) ( nm ) 0 0.422 9.4 8.8 0.007 0.336 12.4 9.0 0.01 0.317 13.2 9.2 0.02 0.293 14.2 0.03 0.188 25.4 16.6 0.05 0.190 26.0 0.1 0.163 32.6 16.3 0.2 0.165 31.6 Table 2 An approach for probing structure which does not ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch