Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 160
Figure 5 : Dielectric resonator for substrates is then excited in the TE018 mode
and a resonance of the combined post - air - material ... A nice feature of split -
post resonators is that they can be designed to operate in the low gigahertz
region .
Figure 5 : Dielectric resonator for substrates is then excited in the TE018 mode
and a resonance of the combined post - air - material ... A nice feature of split -
post resonators is that they can be designed to operate in the low gigahertz
region .
Page 161
The method has the advantage that the error introduced by the sample length is
smaller than measurements of resonances across the sample such as in the split
- post resonator . The full - sheet resonance method is limited in its ability to ...
The method has the advantage that the error introduced by the sample length is
smaller than measurements of resonances across the sample such as in the split
- post resonator . The full - sheet resonance method is limited in its ability to ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers