Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 155
In this technique the sample is inserted through a slot in the transmission line and
the transmission and reflection coefficients are used to determine permittivity ( 11
- 22 ) . Open Transmission - line Methods Many microelectronic applications ...
In this technique the sample is inserted through a slot in the transmission line and
the transmission and reflection coefficients are used to determine permittivity ( 11
- 22 ) . Open Transmission - line Methods Many microelectronic applications ...
Page 160
Dielectric Resonator Sample Dielectric Resonator ! Figure 5 : Dielectric resonator
for substrates is then excited in the TE018 mode and a resonance of the
combined post - air - material system is obtained . Nishikawa et al . ( 51 ) have
used the ...
Dielectric Resonator Sample Dielectric Resonator ! Figure 5 : Dielectric resonator
for substrates is then excited in the TE018 mode and a resonance of the
combined post - air - material system is obtained . Nishikawa et al . ( 51 ) have
used the ...
Page 161
magnetic field couplers _ - - - Figure 6 : Full sheet resonance technique in the
sample . The main difficulty in this technique is mode identification and
degenerate modes . The method has the advantage that the error introduced by
the sample ...
magnetic field couplers _ - - - Figure 6 : Full sheet resonance technique in the
sample . The main difficulty in this technique is mode identification and
degenerate modes . The method has the advantage that the error introduced by
the sample ...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers