Low-dielectric Constant MaterialsMaterials Research Society, 1995 - Electric insulators and insulation |
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Page 267
SILICA AEROGEL : AN INTRINSICALLY LOW DIELECTRIC CONSTANT
MATERIAL * LAWRENCE W . HRUBESH Chemistry and Material Science
Department , Lawrence Livermore National Laboratory , Box 808 , Livermore ,
California ...
SILICA AEROGEL : AN INTRINSICALLY LOW DIELECTRIC CONSTANT
MATERIAL * LAWRENCE W . HRUBESH Chemistry and Material Science
Department , Lawrence Livermore National Laboratory , Box 808 , Livermore ,
California ...
Page 270
Metallization and Patterning The surfaces of as - prepared silica aerogel are
sufficiently smooth to allow direct metallization by vapor or sputter deposition .
LLNL has demonstrated low resolution metal patterns produced by vapor
deposition ...
Metallization and Patterning The surfaces of as - prepared silica aerogel are
sufficiently smooth to allow direct metallization by vapor or sputter deposition .
LLNL has demonstrated low resolution metal patterns produced by vapor
deposition ...
Page 271
For dry silica aerogel with a density of 100 kg / m3 , the dielectric conductivity
ranges from 1 . 1x104 to 8 . 1x10 - 6 12 - 1cm - 1 in the frequency range from 3 to
40 GHz . The typical volume resistivity for dry silica aerogels ( i . e . , 21f / o ) with
...
For dry silica aerogel with a density of 100 kg / m3 , the dielectric conductivity
ranges from 1 . 1x104 to 8 . 1x10 - 6 12 - 1cm - 1 in the frequency range from 3 to
40 GHz . The typical volume resistivity for dry silica aerogels ( i . e . , 21f / o ) with
...
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Contents
VMethods and Needs for Low K Material Research | 5 |
Investigations of the Low Dielectric Constant Fluorinated | 29 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
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absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce reported requirements resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal expansion thermal stability thickness thin films values vapor various Volume wafers