Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 268
... silica aerogels will be compared with those of other porous dielectric materials . INTRINSIC DIELECTRIC PROPERTIES OF SILICA AEROGELS Silica aerogels have intrinsically low dielectric permittivity for the following reasons : • · they ...
... silica aerogels will be compared with those of other porous dielectric materials . INTRINSIC DIELECTRIC PROPERTIES OF SILICA AEROGELS Silica aerogels have intrinsically low dielectric permittivity for the following reasons : • · they ...
Page 269
... silica , this relation is K ' - 1 = 1.42p ; our data for dried silica ... aerogels gives them the intrinsically low dielectric properties associated ... SILICA AEROGEL SYNTHESIS AND PROCESSING Bulk Silica Aerogels The sol - gel chemistry ...
... silica , this relation is K ' - 1 = 1.42p ; our data for dried silica ... aerogels gives them the intrinsically low dielectric properties associated ... SILICA AEROGEL SYNTHESIS AND PROCESSING Bulk Silica Aerogels The sol - gel chemistry ...
Page 272
... silica aerogels Figure 2. Comparison of properties for three types of porous dielectric materials References : 1. A.R. von Hippel , Dielectric and Waves , ( J.Wiley and Sons , New York , 1954 ) , p . 28 . 2. L.W. Hrubesh , L.E. Keene ...
... silica aerogels Figure 2. Comparison of properties for three types of porous dielectric materials References : 1. A.R. von Hippel , Dielectric and Waves , ( J.Wiley and Sons , New York , 1954 ) , p . 28 . 2. L.W. Hrubesh , L.E. Keene ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch