Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A. |
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Page 71
3,4 In multilayered devices , a dielectric polyimide is interfaced to itself as well as several different materials , such as silicon and silicon derivatives , metals , and ceramics . Thus , the reliability of multilayered devices ...
3,4 In multilayered devices , a dielectric polyimide is interfaced to itself as well as several different materials , such as silicon and silicon derivatives , metals , and ceramics . Thus , the reliability of multilayered devices ...
Page 117
As compared to silicon dioxide , organic dielectrics with K < 3.84 reduce power dissipation , crosstälk and RC delays in interconnects . Curing is essential after deposition of these materials to initiate polymerization reactions and ...
As compared to silicon dioxide , organic dielectrics with K < 3.84 reduce power dissipation , crosstälk and RC delays in interconnects . Curing is essential after deposition of these materials to initiate polymerization reactions and ...
Page 148
Results and Discussion For PS on oxide covered silicon surfaces , the dewetting behavior observed by Reiter was reproduced ; dewetting was observed for very thin films at elevated temperatures . In addition , a decrease in the ...
Results and Discussion For PS on oxide covered silicon surfaces , the dewetting behavior observed by Reiter was reproduced ; dewetting was observed for very thin films at elevated temperatures . In addition , a decrease in the ...
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Contents
VaMethods | 3 |
Fluorinated Low Thermal Expansion Coefficient Polyimides | 19 |
Investigations of the Low Dielectric Constant Fluorinated | 31 |
Copyright | |
21 other sections not shown
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Common terms and phrases
absorption addition adhesion aerogels alternating annealing applications bond bulk capacitance chemical circuit coating coefficient compared copolyimide copolymer copper cured decrease defects density deposition determined device dielectric properties effect electrical electronic energy etch field Figure film thickness fluorinated frequency function glass higher IEEE imaging improve in-plane increase indicate initial integrated interconnect interlayer dielectric layer light loss low dielectric constant lower materials measurements mechanical metal method microelectronic Microwave modulus moisture monomers observed obtained optical organic oxide Parylene patterns performance permittivity planarization plasma polishing polyimide film polymer polymeric prepared properties range reduce requirements Research resistance resonators sample shown in Figure shows silica silicon SiO2 SOG film solution stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal stability thickness thin films values vapor various Volume wafer
Bibliographic information
| Title | Low-Dielectric Constant Materials-Synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A. Materials Research Society symposia proceedings, ISSN 0272-9172 Volume 381 of Materials Research Society: Materials Research Society symposia proceedings |
| Editor | Toh-Ming Lu |
| Publisher | Materials Research Society, 1995 |
| Original from | the University of Michigan |
| Digitized | 10 Dec 2007 |
| ISBN | 1558992847, 9781558992849 |
| Length | 288 pages |
| Subjects | › › Technology & Engineering / Electronics / General |
| Export Citation | BiBTeX EndNote RefMan |