Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 51
... spin coated onto silicon wafers . Measurements made on the photopolymerized coatings give low dielectric constants . These coatings also display excellent thermal stability . INTRODUCTION Low dielectric constant insulators are critical ...
... spin coated onto silicon wafers . Measurements made on the photopolymerized coatings give low dielectric constants . These coatings also display excellent thermal stability . INTRODUCTION Low dielectric constant insulators are critical ...
Page 55
... spin coating solution . Using this approach , the solution was spin coated onto vapor deposited aluminum coated silicon wafers and photopolymerization of the monomer- polymer mixture was affected by the irradiation of the wafers for 30 ...
... spin coating solution . Using this approach , the solution was spin coated onto vapor deposited aluminum coated silicon wafers and photopolymerization of the monomer- polymer mixture was affected by the irradiation of the wafers for 30 ...
Page 105
... spin- coated onto silicon wafers . Fluorinated hydrocarbon polymers gave low dielectric constants of 2.0 - 2.4 which was close to that of PTFE . However , the thermal stability of these fluorinated polymers inferior to that of the non ...
... spin- coated onto silicon wafers . Fluorinated hydrocarbon polymers gave low dielectric constants of 2.0 - 2.4 which was close to that of PTFE . However , the thermal stability of these fluorinated polymers inferior to that of the non ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch