Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 8
... SPIN - ON ORGANIC FILMS Most of the work on organic dielectric is based on spin - on films . For example , a wide variety of polyimide ( PI ) films are used as stress relieve layer over the chips and in packaging applications . Because ...
... SPIN - ON ORGANIC FILMS Most of the work on organic dielectric is based on spin - on films . For example , a wide variety of polyimide ( PI ) films are used as stress relieve layer over the chips and in packaging applications . Because ...
Page 59
... spin - on films derived from a family of non- carbonyl containing aromatic polyethers . Fluorinated poly ( arylethers ) based on decafluoro- biphenyl exhibit thermal stability comparable to polyimides , from ten to forty times lower ...
... spin - on films derived from a family of non- carbonyl containing aromatic polyethers . Fluorinated poly ( arylethers ) based on decafluoro- biphenyl exhibit thermal stability comparable to polyimides , from ten to forty times lower ...
Page 198
... Spin - on Organic 3.0-3.7 Polyimide Spin - on 2.7-3.0 Polysilsesquioxane ( Si polymer ) Spin - on 2.7 Benzocyclobutene ( BCB ) Spin - on 2.7 Parylene N CVD ~ 2.5 Fluorinated polyimide Spin - on 2.3 Parylene F CVD ~ 2.3 Poly ...
... Spin - on Organic 3.0-3.7 Polyimide Spin - on 2.7-3.0 Polysilsesquioxane ( Si polymer ) Spin - on 2.7 Benzocyclobutene ( BCB ) Spin - on 2.7 Parylene N CVD ~ 2.5 Fluorinated polyimide Spin - on 2.3 Parylene F CVD ~ 2.3 Poly ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch